America Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration, and multi-chip packaging. The company provides design, assembly, test, and custom engineering services for thin-device technology.
